3D printed porous dielectric substrates for rf applications

Vana SnigdhaTummala; Ahsan Mian; Nowrin H. Chamok; Mohammod Ali; Jallisa Clifford; Prasun Majumdar

doi:10.1115/IMECE201665880

3D printed porous dielectric substrates for rf applications

Vana SnigdhaTummala, Ahsan Mian, Nowrin H. Chamok, Mohammod Ali, Jallisa Clifford, Prasun Majumdar

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Micro- and Nano-Systems Engineering and Packaging
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Electronic)	9780791850640
DOIs	https://doi.org/10.1115/IMECE201665880
State	Published - 2016
Externally published	Yes
Event	ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE 2016 - Phoenix, United States Duration: Nov 11 2016 → Nov 17 2016

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume	10

Conference

Conference	ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE 2016
Country/Territory	United States
City	Phoenix
Period	11/11/16 → 11/17/16

ASJC Scopus Subject Areas

Mechanical Engineering

Access to Document

10.1115/IMECE201665880

Cite this

SnigdhaTummala, V., Mian, A., Chamok, N. H., Ali, M., Clifford, J., & Majumdar, P. (2016). 3D printed porous dielectric substrates for rf applications. In Micro- and Nano-Systems Engineering and Packaging (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 10). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE201665880

3D printed porous dielectric substrates for rf applications. / SnigdhaTummala, Vana; Mian, Ahsan; Chamok, Nowrin H. et al.
Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), 2016. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 10).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

SnigdhaTummala, V, Mian, A, Chamok, NH, Ali, M, Clifford, J & Majumdar, P 2016, 3D printed porous dielectric substrates for rf applications. in Micro- and Nano-Systems Engineering and Packaging. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 10, American Society of Mechanical Engineers (ASME), ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE 2016, Phoenix, United States, 11/11/16. https://doi.org/10.1115/IMECE201665880

@inproceedings{e391bb82dc3a410eb6473e6a5e9e2bd8,

title = "3D printed porous dielectric substrates for rf applications",

author = "Vana SnigdhaTummala and Ahsan Mian and Chamok, {Nowrin H.} and Mohammod Ali and Jallisa Clifford and Prasun Majumdar",

note = "Publisher Copyright: Copyright {\textcopyright} 2016 by ASME.; ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE 2016 ; Conference date: 11-11-2016 Through 17-11-2016",

year = "2016",

doi = "10.1115/IMECE201665880",

language = "English",

series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)",

publisher = "American Society of Mechanical Engineers (ASME)",

booktitle = "Micro- and Nano-Systems Engineering and Packaging",

}

TY - GEN

T1 - 3D printed porous dielectric substrates for rf applications

AU - SnigdhaTummala, Vana

AU - Mian, Ahsan

AU - Chamok, Nowrin H.

AU - Ali, Mohammod

AU - Clifford, Jallisa

AU - Majumdar, Prasun

PY - 2016

Y1 - 2016

UR - http://www.scopus.com/inward/record.url?scp=85021677630&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85021677630&partnerID=8YFLogxK

U2 - 10.1115/IMECE201665880

DO - 10.1115/IMECE201665880

M3 - Conference contribution

AN - SCOPUS:85021677630

T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

BT - Micro- and Nano-Systems Engineering and Packaging

PB - American Society of Mechanical Engineers (ASME)

T2 - ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE 2016

Y2 - 11 November 2016 through 17 November 2016

ER -

3D printed porous dielectric substrates for rf applications

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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