A high sensitive piezoresistive sensor for stress measurements in packaged semiconductor die

Ahsan Mian; Jeffrey C. Suhling; Richard C. Jaeger

doi:10.1109/WMED.2006.1678287

A high sensitive piezoresistive sensor for stress measurements in packaged semiconductor die

Ahsan Mian, Jeffrey C. Suhling, Richard C. Jaeger

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06
Pages	19-20
Number of pages	2
DOIs	https://doi.org/10.1109/WMED.2006.1678287
State	Published - 2006
Externally published	Yes
Event	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06 - Boise, ID, United States Duration: Apr 14 2006 → Apr 14 2006

Publication series

Name	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

Conference

Conference	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06
Country/Territory	United States
City	Boise, ID
Period	4/14/06 → 4/14/06

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/WMED.2006.1678287

Cite this

A high sensitive piezoresistive sensor for stress measurements in packaged semiconductor die. / Mian, Ahsan; Suhling, Jeffrey C.; Jaeger, Richard C.
2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06. 2006. p. 19-20 1678287 (2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mian, A, Suhling, JC & Jaeger, RC 2006, A high sensitive piezoresistive sensor for stress measurements in packaged semiconductor die. in 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06., 1678287, 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06, pp. 19-20, 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06, Boise, ID, United States, 4/14/06. https://doi.org/10.1109/WMED.2006.1678287

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title = "A high sensitive piezoresistive sensor for stress measurements in packaged semiconductor die",

author = "Ahsan Mian and Suhling, {Jeffrey C.} and Jaeger, {Richard C.}",

year = "2006",

doi = "10.1109/WMED.2006.1678287",

language = "English",

isbn = "142440374X",

series = "2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06",

pages = "19--20",

booktitle = "2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06",

note = "2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06 ; Conference date: 14-04-2006 Through 14-04-2006",

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DO - 10.1109/WMED.2006.1678287

M3 - Conference contribution

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T3 - 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

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BT - 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

T2 - 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

Y2 - 14 April 2006 through 14 April 2006

ER -

A high sensitive piezoresistive sensor for stress measurements in packaged semiconductor die

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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