A Review on Laser Processing in Electronic and MEMS Packaging

Research output: Contribution to journal › Review article › peer-review

Original language	English
Article number	030801
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	139
Issue number	3
DOIs	https://doi.org/10.1115/1.4036239
State	Published - Sep 1 2017
Externally published	Yes

ASJC Scopus Subject Areas

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title = "A Review on Laser Processing in Electronic and MEMS Packaging",

author = "Kaysar Rahim and Ahsan Mian",

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