Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

Ahsan Mian; Mahommad M. Hailat; Golam Newaz; Rahul Patwa; Hans Herfurth

doi:10.1115/IMECE2010-40590

Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

Ahsan Mian, Mahommad M. Hailat, Golam Newaz, Rahul Patwa, Hans Herfurth

Wright State University

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon.

Original language	American English
Journal	ASME 2010 International Mechanical Engineering Congress and Exposition
Volume	10 - Micro and Nano Systems
DOIs	https://doi.org/10.1115/IMECE2010-40590
State	Published - Nov 12 2010

Keywords

Aluminum
Copper
Lasers
Stress

Disciplines

Engineering
Materials Science and Engineering
Mechanical Engineering

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10.1115/IMECE2010-40590License: Unspecified

Cite this

@article{928ce0362dcf4cf3914cfd6e6a685196,

title = "Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load",

abstract = " This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon. Copyright {\textcopyright} 2010 by ASME",

keywords = "Aluminum, Copper, Lasers, Stress",

author = "Ahsan Mian and Hailat, {Mahommad M.} and Golam Newaz and Rahul Patwa and Hans Herfurth",

year = "2010",

month = nov,

day = "12",

doi = "10.1115/IMECE2010-40590",

language = "American English",

volume = "10 - Micro and Nano Systems",

journal = "ASME 2010 International Mechanical Engineering Congress and Exposition",

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TY - JOUR

T1 - Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

AU - Mian, Ahsan

AU - Hailat, Mahommad M.

AU - Newaz, Golam

AU - Patwa, Rahul

AU - Herfurth, Hans

PY - 2010/11/12

Y1 - 2010/11/12

N2 - This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon. Copyright © 2010 by ASME

AB - This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon. Copyright © 2010 by ASME

KW - Aluminum

KW - Copper

KW - Lasers

KW - Stress

UR - https://corescholar.libraries.wright.edu/mme/371

U2 - 10.1115/IMECE2010-40590

DO - 10.1115/IMECE2010-40590

M3 - Article

VL - 10 - Micro and Nano Systems

JO - ASME 2010 International Mechanical Engineering Congress and Exposition

JF - ASME 2010 International Mechanical Engineering Congress and Exposition

ER -

Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

Abstract

Keywords

Disciplines

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