Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

A. Mian; M. Hailat; G. Newaz; R. Patwa; H. Herfurth

doi:10.1115/IMECE2010-40590

Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

A. Mian, M. Hailat, G. Newaz, R. Patwa, H. Herfurth

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon.

Original language	English
Title of host publication	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010
Publisher	American Society of Mechanical Engineers (ASME)
Pages	71-74
Number of pages	4
Volume	10 - Micro and Nano Systems
ISBN (Print)	9780791844472
DOIs	https://doi.org/10.1115/IMECE2010-40590
State	Published - Nov 12 2010
Externally published	Yes
Event	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010 - Vancouver, BC, Canada Duration: Nov 12 2010 → Nov 18 2010

Conference

Conference	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010
Country/Territory	Canada
City	Vancouver, BC
Period	11/12/10 → 11/18/10

ASJC Scopus Subject Areas

Mechanical Engineering

Keywords

Aluminum
Copper
Lasers
Stress

Disciplines

Materials Science and Engineering
Mechanical Engineering

Access to Document

10.1115/IMECE2010-40590License: Unspecified

Cite this

Mian, A., Hailat, M., Newaz, G., Patwa, R., & Herfurth, H. (2010). Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load. In ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010 (Vol. 10 - Micro and Nano Systems, pp. 71-74). Article IMECE2010-40590 American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2010-40590

Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load. / Mian, A.; Hailat, M.; Newaz, G. et al.
ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. Vol. 10 - Micro and Nano Systems American Society of Mechanical Engineers (ASME), 2010. p. 71-74 IMECE2010-40590.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mian, A, Hailat, M, Newaz, G, Patwa, R & Herfurth, H 2010, Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load. in ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. vol. 10 - Micro and Nano Systems, IMECE2010-40590, American Society of Mechanical Engineers (ASME), pp. 71-74, ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010, Vancouver, BC, Canada, 11/12/10. https://doi.org/10.1115/IMECE2010-40590

Mian A, Hailat M, Newaz G, Patwa R, Herfurth H. Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load. In ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. Vol. 10 - Micro and Nano Systems. American Society of Mechanical Engineers (ASME). 2010. p. 71-74. IMECE2010-40590 doi: 10.1115/IMECE2010-40590

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title = "Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load",

abstract = " This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon. Copyright {\textcopyright} 2010 by ASME",

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AU - Mian, A.

AU - Hailat, M.

AU - Newaz, G.

AU - Patwa, R.

AU - Herfurth, H.

PY - 2010/11/12

Y1 - 2010/11/12

N2 - This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon. Copyright © 2010 by ASME

AB - This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon. Copyright © 2010 by ASME

KW - Aluminum

KW - Copper

KW - Lasers

KW - Stress

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BT - ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010

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Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

Abstract

Conference

ASJC Scopus Subject Areas

Keywords

Disciplines

Access to Document

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