Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load

A. Mian; M. Hailat; G. Newaz; R. Patwa; H. Herfurth

doi:10.1115/IMECE2010-40590

Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load

A. Mian, M. Hailat, G. Newaz, R. Patwa, H. Herfurth

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010
Publisher	American Society of Mechanical Engineers (ASME)
Pages	71-74
Number of pages	4
ISBN (Print)	9780791844472
DOIs	https://doi.org/10.1115/IMECE2010-40590
State	Published - 2010
Externally published	Yes
Event	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010 - Vancouver, BC, Canada Duration: Nov 12 2010 → Nov 18 2010

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume	10

Conference

Conference	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010
Country/Territory	Canada
City	Vancouver, BC
Period	11/12/10 → 11/18/10

ASJC Scopus Subject Areas

Mechanical Engineering

Access to Document

10.1115/IMECE2010-40590

Cite this

Mian, A., Hailat, M., Newaz, G., Patwa, R., & Herfurth, H. (2010). Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load. In ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010 (pp. 71-74). (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 10). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2010-40590

Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load. / Mian, A.; Hailat, M.; Newaz, G. et al.
ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. American Society of Mechanical Engineers (ASME), 2010. p. 71-74 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 10).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mian, A, Hailat, M, Newaz, G, Patwa, R & Herfurth, H 2010, Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load. in ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 10, American Society of Mechanical Engineers (ASME), pp. 71-74, ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010, Vancouver, BC, Canada, 11/12/10. https://doi.org/10.1115/IMECE2010-40590

Mian A, Hailat M, Newaz G, Patwa R, Herfurth H. Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load. In ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. American Society of Mechanical Engineers (ASME). 2010. p. 71-74. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)). doi: 10.1115/IMECE2010-40590

Mian, A. ; Hailat, M. ; Newaz, G. et al. / Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load. ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010. American Society of Mechanical Engineers (ASME), 2010. pp. 71-74 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)).

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Characterization of laser processed sub-millimeter lap joints between copper and aluminum under tensile load

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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Cite this