Chip-level spray cooling of an LD-MOSFET RF power amplifier+

A. C. Cotler; E. R. Brown; V. Dhir; M. C. Shaw

doi:10.1109/TCAPT.2004.828550

Chip-level spray cooling of an LD-MOSFET RF power amplifier⁺

A. C. Cotler, E. R. Brown, V. Dhir, M. C. Shaw

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	411-416
Number of pages	6
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	27
Issue number	2
DOIs	https://doi.org/10.1109/TCAPT.2004.828550
State	Published - Jun 2004
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/TCAPT.2004.828550

Cite this

@article{6516efeb15104e3ea516d29bd05f1aa3,

title = "Chip-level spray cooling of an LD-MOSFET RF power amplifier+",

author = "Cotler, {A. C.} and Brown, {E. R.} and V. Dhir and Shaw, {M. C.}",

year = "2004",

month = jun,

doi = "10.1109/TCAPT.2004.828550",

language = "English",

volume = "27",

pages = "411--416",

journal = "IEEE Transactions on Components and Packaging Technologies",

issn = "1521-3331",

number = "2",

}

TY - JOUR

T1 - Chip-level spray cooling of an LD-MOSFET RF power amplifier+

AU - Cotler, A. C.

AU - Brown, E. R.

AU - Dhir, V.

AU - Shaw, M. C.

PY - 2004/6

Y1 - 2004/6

UR - http://www.scopus.com/inward/record.url?scp=3242784824&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=3242784824&partnerID=8YFLogxK

U2 - 10.1109/TCAPT.2004.828550

DO - 10.1109/TCAPT.2004.828550

M3 - Article

AN - SCOPUS:3242784824

SN - 1521-3331

VL - 27

SP - 411

EP - 416

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 2

ER -

Chip-level spray cooling of an LD-MOSFET RF power amplifier+

ASJC Scopus Subject Areas

Access to Document

Other files and links

Cite this

Chip-level spray cooling of an LD-MOSFET RF power amplifier⁺