@inproceedings{56615bbd8311446a8333ea8b315c7470,
title = "EVALUATION OF DIE STRESS USING VAN DER PAUW SENSORS",
author = "Mian, {A. K.M.} and Suhling, {J. C.} and Jaeger, {R. C.} and Wilamowski, {B. M.}",
note = "Publisher Copyright: {\textcopyright} 1997 American Society of Mechanical Engineers (ASME). All rights reserved.; ASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Applications of Experimental Mechanics to Electronic Packaging ; Conference date: 16-11-1997 Through 21-11-1997",
year = "1997",
doi = "10.1115/IMECE1997-1228",
language = "English",
series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)",
publisher = "American Society of Mechanical Engineers (ASME)",
pages = "59--67",
booktitle = "Applications of Experimental Mechanics to Electronic Packaging",
}