Abstract
Experimental evaluation of high temperature, Fatigue Crack Growth Rate (FCGR) data for Ti-6A1-4V, a titanium alloy, is presented. The FCGR data were measured at room temperature, 175, 230, 290 and 345°C using the Direct Current Potential Difference (DCPD) technique. Compact Tension (CT) specimens were used in the program and crack growth rates (da/dN) vs. Mode I stress intensity factor ranges (ΔΚ) were plotted as a function of temperature. A temperature rise from 175 to 345°C did not cause a substantial increase in crack growth rates within the Stage II region where a linear relationship describes the behavior. Fonnation of secondary cracks, observed at higher temperatures, may have slowed the crack propagation as observed in the fractography.
| Original language | American English |
|---|---|
| Pages (from-to) | 229-236 |
| Number of pages | 8 |
| Journal | High Temperature Materials and Processes |
| Volume | 21 |
| Issue number | 4 |
| DOIs | |
| State | Published - Dec 2002 |
ASJC Scopus Subject Areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Physical and Theoretical Chemistry
Keywords
- CT specimen
- DCPD
- Fatigue Crack Growth Rate (FCGR)
- High Temperature
- Low Cycle Fatigue
- Ti-6Al-4V
Disciplines
- Biomedical Engineering and Bioengineering
- Engineering
- Industrial Engineering
- Operations Research, Systems Engineering and Industrial Engineering