Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K.M. Mian, J. C. Suhling, R. C. Jaeger

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The (111) surface of silicon offers unique advantages for fabrication of piezoresistive stress sensors. Resistive sensor elements fabricated on this particular surface respond to all six components comprising the state of stress. Hence, a multi-element rosette has the capability of measuring the complete stress state at a point in the material. To extract the stress state at points on the die from the resistance changes measured with the sensor rosettes, it is necessary to have accurately calibrated values of six piezoresistive coefficients. Four-point bending and wafer-level calibration methods can measure four out of six piezoresistive coefficients for both p- and n-type resistors. To measure the other two coefficients, a hydrostatic test method has been developed where a high capacity pressure vessel is used to apply triaxial load on a single die. During the test procedure, resistance changes of resistors on the die are monitored. The slopes of the adjusted resistance change versus pressure plots are then used to calculate the desired last two coefficients. A step-by-step hydrostatic test procedure is demonstrated and sample data are presented.
Original languageEnglish
Title of host publicationASME 1997 International Mechanical Engineering Congress and Exposition
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages29-36
Number of pages8
Volume226
ISBN (Electronic)9780791818503
DOIs
StatePublished - 1997
Externally publishedYes
EventASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Applications of Experimental Mechanics to Electronic Packaging - Dallas, United States
Duration: Nov 16 1997Nov 21 1997

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume1997-K

Conference

ConferenceASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Applications of Experimental Mechanics to Electronic Packaging
Country/TerritoryUnited States
CityDallas
Period11/16/9711/21/97

ASJC Scopus Subject Areas

  • Mechanical Engineering

Keywords

  • Hydrostatics
  • Sensors
  • Stress
  • Hydrostatic testing
  • Resistors
  • Calibration
  • Manufacturing
  • Pressure
  • Pressure vessels
  • Semiconductor wafers
  • Silicon

Disciplines

  • Materials Science and Engineering
  • Mechanical Engineering

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