In-situ stress state measurements during chip-on-board assembly

Yida Zou; Jeffrey C. Suhling; R. Wayne Johnson; Richard C. Jaeger; A. K.M. Mian

doi:10.1109/6104.755088

In-situ stress state measurements during chip-on-board assembly

Yida Zou
, Jeffrey C. Suhling
, R. Wayne Johnson
, Richard C. Jaeger
, A. K.M. Mian

Mechanical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	38-52
Number of pages	15
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Volume	22
Issue number	1
DOIs	https://doi.org/10.1109/6104.755088
State	Published - 1999

ASJC Scopus Subject Areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/6104.755088

Cite this

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title = "In-situ stress state measurements during chip-on-board assembly",

author = "Yida Zou and Suhling, \{Jeffrey C.\} and \{Wayne Johnson\}, R. and Jaeger, \{Richard C.\} and Mian, \{A. K.M.\}",

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journal = "IEEE Transactions on Electronics Packaging Manufacturing",

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AU - Zou, Yida

AU - Suhling, Jeffrey C.

AU - Wayne Johnson, R.

AU - Jaeger, Richard C.

AU - Mian, A. K.M.

PY - 1999

Y1 - 1999

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EP - 52

JO - IEEE Transactions on Electronics Packaging Manufacturing

JF - IEEE Transactions on Electronics Packaging Manufacturing

IS - 1

ER -

In-situ stress state measurements during chip-on-board assembly

ASJC Scopus Subject Areas

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