Measurement of backside flip chip die stresses using piezoresistive test die

Jeffrey C. Suhling; R. Wayne Johnson; A. K.M. Mian; M. Kaysar Rahim; Yida Zou; Srikanth Ragam; Michael Palmer; Charles D. Ellis; Richard C. Jaeger

Measurement of backside flip chip die stresses using piezoresistive test die

Jeffrey C. Suhling, R. Wayne Johnson, A. K.M. Mian, M. Kaysar Rahim, Yida Zou, Srikanth Ragam, Michael Palmer, Charles D. Ellis, Richard C. Jaeger

Research output: Contribution to journal › Conference article › peer-review

Original language	English
Pages (from-to)	298-303
Number of pages	6
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3906
State	Published - 1999
Externally published	Yes
Event	Proceedings of the 1999 International Symposium on Microelectronics - Chicago, IL, USA Duration: Oct 26 1999 → Oct 28 1999

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Cite this

@article{b41348f3250a4733917af49e964071d3,

title = "Measurement of backside flip chip die stresses using piezoresistive test die",

author = "Suhling, {Jeffrey C.} and Johnson, {R. Wayne} and Mian, {A. K.M.} and Rahim, {M. Kaysar} and Yida Zou and Srikanth Ragam and Michael Palmer and Ellis, {Charles D.} and Jaeger, {Richard C.}",

year = "1999",

language = "English",

volume = "3906",

pages = "298--303",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

note = "Proceedings of the 1999 International Symposium on Microelectronics ; Conference date: 26-10-1999 Through 28-10-1999",

}

TY - JOUR

T1 - Measurement of backside flip chip die stresses using piezoresistive test die

AU - Suhling, Jeffrey C.

AU - Johnson, R. Wayne

AU - Mian, A. K.M.

AU - Rahim, M. Kaysar

AU - Zou, Yida

AU - Ragam, Srikanth

AU - Palmer, Michael

AU - Ellis, Charles D.

AU - Jaeger, Richard C.

PY - 1999

Y1 - 1999

UR - http://www.scopus.com/inward/record.url?scp=0033344349&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033344349&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0033344349

SN - 0277-786X

VL - 3906

SP - 298

EP - 303

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Proceedings of the 1999 International Symposium on Microelectronics

Y2 - 26 October 1999 through 28 October 1999

ER -

Measurement of backside flip chip die stresses using piezoresistive test die

ASJC Scopus Subject Areas

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Cite this