MEMS and Si Micromachined Circuits for High-Frequency Applications

Linda P.B. Katehi; James F. Harvey; Elliott Brown

doi:10.1109/22.989969

MEMS and Si Micromachined Circuits for High-Frequency Applications

Linda P.B. Katehi, James F. Harvey, Elliott Brown

Research output: Contribution to journal › Article › peer-review

Abstract

RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.

Original language	English
Pages (from-to)	858-866
Number of pages	9
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	50
Issue number	3
DOIs	https://doi.org/10.1109/22.989969
State	Published - Mar 2002
Externally published	Yes

ASJC Scopus Subject Areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

High-frequency circuits
On-wafer packaging
RF MEMS
Si micromachining
Three-dimensional integration

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10.1109/22.989969

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title = "MEMS and Si Micromachined Circuits for High-Frequency Applications",

abstract = "RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.",

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AU - Harvey, James F.

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N2 - RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.

AB - RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.

KW - High-frequency circuits

KW - On-wafer packaging

KW - RF MEMS

KW - Si micromachining

KW - Three-dimensional integration

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MEMS and Si Micromachined Circuits for High-Frequency Applications

Abstract

ASJC Scopus Subject Areas

Keywords

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