Microstructural analysis of laser micro-welds between copper and aluminum

A. Mian; C. Taylor; H. Vijwani

doi:10.1007/s00542-014-2385-3

Microstructural analysis of laser micro-welds between copper and aluminum

A. Mian
, C. Taylor
, H. Vijwani

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	261-267
Number of pages	7
Journal	Microsystem Technologies
Volume	22
Issue number	2
DOIs	https://doi.org/10.1007/s00542-014-2385-3
State	Published - Feb 1 2016
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1007/s00542-014-2385-3

Cite this

@article{ca2272a02c6c4a9780214a51493a8677,

title = "Microstructural analysis of laser micro-welds between copper and aluminum",

author = "A. Mian and C. Taylor and H. Vijwani",

note = "Publisher Copyright: {\textcopyright} 2014, Springer-Verlag Berlin Heidelberg.",

year = "2016",

month = feb,

day = "1",

doi = "10.1007/s00542-014-2385-3",

language = "English",

volume = "22",

pages = "261--267",

journal = "Microsystem Technologies",

issn = "0946-7076",

number = "2",

}

TY - JOUR

T1 - Microstructural analysis of laser micro-welds between copper and aluminum

AU - Mian, A.

AU - Taylor, C.

AU - Vijwani, H.

PY - 2016/2/1

Y1 - 2016/2/1

UR - https://www.scopus.com/pages/publications/84954378128

UR - https://www.scopus.com/pages/publications/84954378128#tab=citedBy

U2 - 10.1007/s00542-014-2385-3

DO - 10.1007/s00542-014-2385-3

M3 - Article

AN - SCOPUS:84954378128

SN - 0946-7076

VL - 22

SP - 261

EP - 267

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 2

ER -

Microstructural analysis of laser micro-welds between copper and aluminum

ASJC Scopus Subject Areas

Access to Document

Other files and links

Cite this