Sensitivity of Van der Pauw sensors to uniaxial stress

A. K.M. Mian, J. C. Suhling, R. C. Jaeger

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Pages1/-
StatePublished - 1999
Externally publishedYes
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: Jun 13 1999Jun 19 1999

Conference

ConferenceInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period6/13/996/19/99

ASJC Scopus Subject Areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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