Abstract
The coupled effects of mechanical stress and thermal performance on the electrical function of power electronics are combined within a new analytical framework designated thermomechatronics. The result is a new approach to analyzing the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the package bonds and interconnects. The present analysis focuses on relating the consequences of such cracks on the thermal resistance of the package, which governs the junction temperature of the electronics for fixed power dissipation. The rate of crack growth during operation is then analyzed based on closed-form analytical solutions combined with physically based failure modes for the relevant materials. Finally, the manner in which the present results may be integrated with conventional circuit simulation tools is described.
| Original language | English |
|---|---|
| Pages | 270-278 |
| Number of pages | 9 |
| State | Published - 2000 |
| Externally published | Yes |
| Event | 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic System-ITherm 2000 - Las Vegas, NV, USA Duration: May 23 2000 → May 26 2000 |
Conference
| Conference | 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic System-ITherm 2000 |
|---|---|
| City | Las Vegas, NV, USA |
| Period | 5/23/00 → 5/26/00 |
ASJC Scopus Subject Areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry