Thermomechatronics of Power Electronics

R. E. Watts; K. Fedje; E. R. Brown; M. C. Shaw

doi:10.1115/IMECE2003-41805

Thermomechatronics of Power Electronics

R. E. Watts, K. Fedje, E. R. Brown, M. C. Shaw

Research output: Contribution to conference › Paper › peer-review

Abstract

The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage.

Original language	English
Pages	241-246
Number of pages	6
DOIs	https://doi.org/10.1115/IMECE2003-41805
State	Published - 2003
Externally published	Yes
Event	2003 ASME International Mechanical Engineering Congress - Washington, DC, United States Duration: Nov 15 2003 → Nov 21 2003

Conference

Conference	2003 ASME International Mechanical Engineering Congress
Country/Territory	United States
City	Washington, DC
Period	11/15/03 → 11/21/03

ASJC Scopus Subject Areas

Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1115/IMECE2003-41805

Cite this

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title = "Thermomechatronics of Power Electronics",

abstract = "The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage.",

author = "Watts, \{R. E.\} and K. Fedje and Brown, \{E. R.\} and Shaw, \{M. C.\}",

year = "2003",

doi = "10.1115/IMECE2003-41805",

language = "English",

pages = "241--246",

note = "2003 ASME International Mechanical Engineering Congress ; Conference date: 15-11-2003 Through 21-11-2003",

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AU - Watts, R. E.

AU - Fedje, K.

AU - Brown, E. R.

AU - Shaw, M. C.

PY - 2003

Y1 - 2003

N2 - The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage.

AB - The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage.

UR - https://www.scopus.com/pages/publications/1942472520

UR - https://www.scopus.com/inward/citedby.url?scp=1942472520&partnerID=8YFLogxK

U2 - 10.1115/IMECE2003-41805

DO - 10.1115/IMECE2003-41805

M3 - Paper

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EP - 246

T2 - 2003 ASME International Mechanical Engineering Congress

Y2 - 15 November 2003 through 21 November 2003

ER -

Thermomechatronics of Power Electronics

Abstract

Conference

ASJC Scopus Subject Areas

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