Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Article number020904
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume139
Issue number2
DOIs
StatePublished - Jun 1 2017
Externally publishedYes

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

Keywords

  • 3D printing
  • Dielectric material
  • Porous structure
  • RF applications

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