@article{472d48f959954125912ab46d07caa2f9,
title = "Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications",
keywords = "3D printing, Dielectric material, Porous structure, RF applications",
author = "Tummala, \{Vana Snigdha\} and Ahsan Mian and Chamok, \{Nowrin H.\} and Dhruva Poduval and Mohammod Ali and Jallisa Clifford and Prasun Majumdar",
note = "Publisher Copyright: Copyright {\textcopyright} 2017 by ASME.",
year = "2017",
month = jun,
day = "1",
doi = "10.1115/1.4036384",
language = "English",
volume = "139",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
number = "2",
}